Features
- New MEMS technology
- Highly profiled tip with angle engineering
- Tip visibility provides accurate landing
- Vertical sidewall chip for safe handling
Applications
- Fast topography imaging in oscillating modes
- Tapping mode
- Non-contact mode
- WavemodeTM
- Roughness measurements
- Nanoscale imaging on highly corrugated samples
- Challenging aspect ratios
Specifications
| Parameter | Unit | Nominal | Range |
|---|---|---|---|
| Frequency | kHz | 1500.0 | 200-350 |
| Spring constant | N/m | 40.0 | 24-55 |
| Tip height Ht | µm | 15.0 | 15-50 |
| Tip apex radius | nm | 7.0 | 2-10 |
| Tip side angle θ | ° | 15.0 | +/-0.5° |
| Tip-cantilever angle α | ° | 118.0 | +/-0.5° |
| Cantilever length Lc | µm | 40.0 | +/-1 |
| Cantilever width Wc | µm | 10.0 | +/-1 |
| Cantilever thickness Tc | µm | 3.3 | +/-0.15 |
| Cantilever backside coating | A2 | ||
| Tip-side coating | A2 | ||
| Tip and cantilever material | p-doped Silicon 0.01-0.02 ohm-cm | ||
| Chip dimensions | mm | 3.4x1.6x0.4 | |
Cantilever & tip details
- Tilted tip design Compensates for the AFM head mounting angle, ensuring accurate data on diverse sample surfaces.
- Tip height 15 µm Enables imaging of deeper or difficult-to-access sample regions.
- Tip side angle 22° Minimizes tip-sample convolution for more accurate morphological measurements.
- Tip apex radius 7 nm Provides reliable resolution for advanced AFM applications.