Features
- New MEMS technology
- Long tip: extends AFM capabilities
- Highly profiled tip with angle engineering
- Tip visibility provides accurate landing
- Vertical sidewall chip for safe handling
Specifications
| Parameter | Unit | Nominal | Range |
|---|---|---|---|
| Frequency | kHz | 110.0 | 150-300 |
| Spring constant | N/m | 40.0 | 24-55 |
| Tip height Ht | µm | 100.0 | 75-120 |
| Tip apex radius | nm | 50.0 | 35-75 |
| Tip side angle θ | ° | 15.0 | +/-0.5° |
| Tip-cantilever angle α | ° | 118.0 | +/-0.5° |
| Cantilever length Lc | µm | 115.0 | +/-1 |
| Cantilever width Wc | µm | 40.0 | +/-1 |
| Cantilever thickness Tc | µm | 3.3 | +/-0.15 |
| Cantilever backside coating | P2 | ||
| Tip-side coating | P2 | ||
| Tip and cantilever material | p-doped Silicon 0.01-0.02 ohm-cm | ||
| Chip dimensions | mm | 3.4x1.6x0.4 | |
Cantilever & tip details
- Tilted tip design Compensates for the AFM head mounting angle, ensuring accurate data on diverse sample surfaces.
- Tip height 30 µm Enables imaging of deeper or difficult-to-access sample regions.
- Tip side angle 15° Minimizes tip-sample convolution for more accurate morphological measurements.
- Tip apex radius 50 nm Provides reliable resolution for advanced AFM applications.